New thermal management technology for electronic devices reduces bulk while improving cooling

Electronic devices generate heat, and that heat must be dissipated. If it isn’t, the high temperatures can compromise device function, or even damage the devices and their surroundings.

Now, a team from UIUC and UC Berkeley have published a paper in Nature Electronics detailing a new cooling method that offers a host of benefits, not the least of which is space efficiency that offers a substantial increase over conventional approaches in devices’ power per unit volume.

link

Leave a Reply

Please log in using one of these methods to post your comment:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s